
Japan’s platform for the label and packaging industry
Label Forum Japan 2026
Exhibition, Conference, and Label Pavilion
— all in one event
Held alongside Tokyo Pack 2026 at Tokyo Big Sight
Label Forum Japan 2026 will be held over three days from October 14 (Wed) to 16 (Fri), 2026 at Tokyo Big Sight, Ariake, Tokyo.
Evolving from the inaugural Label Summit in 2006, the event was rebranded as Label Forum Japan in 2008 and has since been held biennially. The 2026 edition marks the 8th event and the second time it will take place at Tokyo Big Sight. Alongside the exhibition, a two-day Conference will be held at the International Conference Center, where leading experts from Japan and overseas will present the latest technologies and market trends.
At the Exhibition, domestic and international exhibitors will showcase cutting-edge technologies and products. The event will bring together a wide spectrum of stakeholders—including label printing companies, package and commercial printers, related suppliers, as well as brand owners, retailers, and end-users—creating a dynamic platform for networking and knowledge exchange.
Within the exhibition hall, the Label Pavilion, a dedicated trade fair for labels, will highlight a wide variety of label products. It will showcase their advanced functions, design appeal, marketing effectiveness, and environmental contributions. By raising awareness among brand owners and end-users, the pavilion aims to further expand demand for labels.
In addition, the East Exhibition Hall of Tokyo Big Sight will simultaneously host TOKYO PACK 2026, organized by the Japan Packaging Institute. Together, these two events provide a rare and valuable opportunity where the forefront of labels and packaging—both essential to everyday life—will be presented under one roof in Tokyo.
visitors in 2024
booths in 2024
exhibitors in 2024
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NEXT LABEL – Co-Creation of Technology, Function, and Sustainability
In the wake of the pandemic, the label market continues to face uncertainty and rapid change. Against this backdrop, Label Forum Japan 2026 will be held under the theme “NEXT LABEL – Co-Creation of Technology, Function, and Sustainability.”
The event will serve as a platform to propose next-generation label products, envision the future of the market, and present new value creation opportunities—signaling the direction of the industry moving forward.
Through the advanced technologies introduced by exhibitors, the forum aims to promote safety, trust, and enrichment in future lifestyles, while fostering the sustainable growth of the label market.
Event Profile

Previous Edition: Label Forum Japan 2024
The previous edition, Label Forum Japan 2024, was held under the theme "Explore the future of sustainable labeling" A total of 104 exhibitors across 188 booths showcased advanced materials, equipment, services, and solutions from across the industry.
Notably, about one-third of the exhibitors were first-time participants, and thanks to the expanded venue, one in three companies presented live demonstrations of machinery and equipment. This provided visitors with a unique opportunity to directly experience the latest technologies and solutions from both domestic and international markets—highlighting the industry’s continued evolution since the prior event.
Exhibitor Information coming soonConference Returns to International Conference Center
After being suspended during the COVID-19 pandemic to ensure social distancing, the conference program will finally return. This year’s conference will feature a wide range of presentations covering key topics such as market trends and future outlooks in the label and packaging industries, case studies and challenges presented by brand owners, and proposals for new business models.
Sessions will include a Keynote Address, as well as specialized tracks such as Brand Owners, International, Market Trends, Technical, and Label Converters. Participants can look forward to cutting-edge insights and knowledge shared by leading experts and professionals at the forefront of their fields. Conference