Held Concurrently with TOKYO PACK 2026 and Hi/Summit Food Development Exhibition 2026
Label Forum Japan 2026 will take place from October 14–16, 2026, in West Hall 3 of Tokyo Big Sight, Japan’s premier exhibition venue.
The event will be held concurrently with TOKYO PACK 2026, one of Asia’s largest packaging exhibitions, as well as the Hi/Summit Food Development Exhibition 2026, a leading trade show dedicated to food ingredients, product development, and food technology.
This unique timing will bring together professionals and businesses from the label, packaging, and food industries, creating valuable opportunities for cross-industry networking, knowledge exchange, and business development.
Visitors will have the opportunity to explore the latest advances in:
- Labeling and packaging solutions
- Printing and converting technologies
- Sustainable packaging innovations
- Food ingredients and product development
- Consumer trends and market opportunities
By connecting multiple industries within a single period and location, Label Forum Japan 2026 provides a unique platform for discovering new ideas, forming strategic partnerships, and identifying emerging business opportunities.
Where Industries Converge, Innovation Begins
The convergence of labels, packaging, and food development creates new possibilities for collaboration and value creation. As a hub for innovation, networking, and industry insight, Label Forum Japan 2026 will serve as a dynamic business platform for companies seeking to shape the future of their industries.
